{"product_id":"ge-fanuc-a02b-0098-b501-master-control-card-assembly","title":"GE Fanuc A02B-0098-B501 Master Control Card Assembly","description":"\u003cp\u003eThe \u003cstrong\u003eGE Fanuc A02B-0098-B501\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eA02B-0098-B501\u003c\/strong\u003e Slot Rack Assembly, operates as a dedicated hardware component for motherboard backplane routing and control card interconnectivity within Fanuc Series 0-MC platforms. This modular rack frame accommodates the main system motherboard and daughtercard expansion slots, establishing parallel communication channels between the main CPU, axis controllers, memory modules, and power supply units.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eA02B-0098-B501\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc \/ Fanuc\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eJapan\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e6.26 lbs (2.84 kg)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard Fanuc 0-MC slot rack frame\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSystem Compatibility\u003c\/td\u003e\n\u003ctd\u003eFanuc Series 0-MC Control Systems\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMounting Type\u003c\/td\u003e\n\u003ctd\u003eInternal control cabinet backplane rack mount\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 55 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStorage Temp\u003c\/td\u003e\n\u003ctd\u003e-20 to 75 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e24 VDC nominal (routed via backplane power rails)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSlot Architecture\u003c\/td\u003e\n\u003ctd\u003eMulti-slot expansion backplane matrix\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication \u0026amp; Firmware Integration\u003c\/h3\u003e\n\u003cp\u003eThe internal backplane bus communication velocity dictates real-time diagnostic execution and axis position loop update rates across all plugged PCBs. System synchronization requires strict firmware flash compatibility between installed daughtercards and the primary master board control ROMs. Discrepancies in board revisions or firmware levels across the backplane bus will cause initialization sequence timeouts, backplane parity faults, or system watchdog halts during power-up.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Are backplane slot positions on the A02B-0098-B501 hot-swappable during CNC operation?\u003c\/p\u003e\n\u003cp\u003eA: No. Removing or inserting PCB modules while 24 VDC control power or backplane bias voltages are active will damage bus line transceivers and trigger immediate CPU system alarms.\u003c\/p\u003e\n\u003cp\u003eQ: What primary electrical checks should be performed if a card inserted into the rack fails to initialize?\u003c\/p\u003e\n\u003cp\u003eA: Verify that backplane supply voltage measures within 21.6 VDC to 26.4 VDC at the card connector pins and inspect edge connectors for surface oxidation or mechanical pin misalignment.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003ePower Isolation: Disconnect and lock out all main 3-phase power feeds and auxiliary 24 VDC control power supplies before servicing the chassis.\u003c\/li\u003e\n\u003cli\u003eFrame Bonding: Connect a heavy-gauge, low-impedance grounding jumper from the metal rack frame to the main cabinet ground bus to provide high-frequency EMI shielding.\u003c\/li\u003e\n\u003cli\u003eEnvironmental Clearance: Maintain at least 100 mm of clear space above and below the rack assembly to ensure unhindered convection cooling through the card cage.\u003c\/li\u003e\n\u003cli\u003eMounting Fasteners: Secure the frame using standard M5 fasteners torqued to 2.5 Nm, verifying at least 5 full threads of engagement into the cabinet sub-panel.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"GE","offers":[{"title":"Default Title","offer_id":50524808904819,"sku":"A02B-0098-B501","price":88.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0644\/4348\/2227\/files\/A02B-0098-B501_Cocoai_8f4b4544-9d4d-46ea-b2f4-cfb46271a512.jpg?v=1790237270","url":"https:\/\/www.dcssupplier.com\/ar\/products\/ge-fanuc-a02b-0098-b501-master-control-card-assembly","provider":"DcsSupplier Limited","version":"1.0","type":"link"}