{"product_id":"emerson-396356-01-0p-controlwave-chassis-and-backplane-assembly","title":"Emerson 396356-01-0P ControlWave Chassis and Backplane Assembly","description":"\u003cp\u003eConfigured for high-density I\/O routing and physical module retention in industrial automation nodes, the \u003cstrong\u003eEmerson 396356-01-0P\u003c\/strong\u003e (\u003cstrong\u003e396356-01-0P\u003c\/strong\u003e Chassis and Backplane Assembly) provides direct physical\/electrical execution. The structural rack assembly establishes the centralized communication backbone and power distribution pathways natively at the hardware tier to interconnect local processing nodes with modular expansion cards.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003e396356-01-0P\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eEmerson\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSeries\u003c\/td\u003e\n\u003ctd\u003eControlWave Series\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUnited States\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e1.45 lbs (0.66 kg) net component mass\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMounting Classification\u003c\/td\u003e\n\u003ctd\u003ePanel mount \/ Rack assembly configuration\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSlot Density\u003c\/td\u003e\n\u003ctd\u003e8 available slots for active I\/O module positioning\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Carrying Capacity\u003c\/td\u003e\n\u003ctd\u003e1650 mA (1.65 A) maximum continuous load at 12 VDC threshold\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBackplane Bus Type\u003c\/td\u003e\n\u003ctd\u003eParallel multi-drop data and power distribution rail\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eEnclosure Profile\u003c\/td\u003e\n\u003ctd\u003eOpen-frame structural chassis housing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProduct Type\u003c\/td\u003e\n\u003ctd\u003ePLC Mounting Racks\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eProcess Control \u0026amp; Instrumentation Interface\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eRegulated Backplane Power Allocation and Bus Velocity\u003c\/strong\u003e The 8-slot backplane matrix incorporates heavy-gauge copper trace paths engineered to distribute up to 1650 mA at 12 VDC continuously across the module positions. This power allocation runs concurrently with real-time processing cycles, maintaining uncompromised backplane bus communication velocity and signal impedance levels across all active slots without inducing localized voltage sags.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eChannel-to-Channel Isolation and Loop Protocol Coexistence\u003c\/strong\u003e The structural trace layouts are spaced to preserve high dielectric isolation parameters between adjacent slot channels. This layout intercepts high-frequency electromagnetic emissions, allowing discrete input\/output cards to cycle fast switching states on the rack while adjacent slots process high-sensitivity analog lines running the 4-20 mA HART loop protocol without experiencing signal distortion.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How does the 1650 mA at 12 VDC specification restrict the insertion of active module cards?\u003c\/p\u003e\n\u003cp\u003eA: The 1650 mA ceiling defines the maximum cumulative current that the backplane copper bus can distribute safely to all 8 slots combined. When engineering the rack layout, the total continuous 12 VDC current draw of the 8 inserted I\/O and communication modules must not exceed this 1.65 A limit to avoid thermal overload on the backplane traces.\u003c\/p\u003e\n\u003cp\u003eQ: Does the 396356-01-0P chassis assembly contain addressable parameters or logic chips?\u003c\/p\u003e\n\u003cp\u003eA: No, the chassis and backplane assembly is an entirely passive mechanical and electrical routing framework containing no microprocessors, flash memory, or configurable registers. Slot tracking and logical channel mapping are handled exclusively by the primary CPU module once it is seated onto the bus.\u003c\/p\u003e","brand":"Emerson","offers":[{"title":"Default Title","offer_id":45109473214579,"sku":"396356-01-0P","price":88.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0644\/4348\/2227\/files\/screenshot_2026-06-17_09-26-14_6fe90730-93e0-4162-a033-782849aa5eae.png?v=1781660506","url":"https:\/\/www.dcssupplier.com\/products\/emerson-396356-01-0p-controlwave-chassis-and-backplane-assembly","provider":"DcsSupplier Limited","version":"1.0","type":"link"}