{"product_id":"ge-fanuc-ic200chs022a-versamax-box-style-i-o-carrier","title":"GE Fanuc IC200CHS022A VersaMax Box-Style I\/O Carrier","description":"\u003cp\u003eThe \u003cstrong\u003eGE Fanuc IC200CHS022A\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eIC200CHS022\u003c\/strong\u003e Box-Style I\/O Carrier, operates as a dedicated hardware component for field terminal breakdown and module mounting within VersaMax platforms.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC200CHS022A\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUnited States\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.34 kg (0.75 lbs)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard VersaMax carrier footprint\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003ePassive carrier backplane distribution\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eModule Capacity\u003c\/td\u003e\n\u003ctd\u003e1 VersaMax I\/O module\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTerminal Type\u003c\/td\u003e\n\u003ctd\u003eIEC Box-Style Terminals\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTerminal Count\u003c\/td\u003e\n\u003ctd\u003e36 terminals\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWire Size Limits\u003c\/td\u003e\n\u003ctd\u003e1 AWG #14-22 wire or 2 wires up to AWG #18\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCommon\/Power Terminals\u003c\/td\u003e\n\u003ctd\u003eUp to 4 connections\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMounting Type\u003c\/td\u003e\n\u003ctd\u003eDIN rail or panel mounting\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus and I\/O Density Scaling\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eBackplane Bus Communication Velocity\u003c\/strong\u003e: Interfaces directly with adjacent carrier base units via integrated carrier-to-carrier connectors, maintaining continuous backplane bus signal pass-through across the local rack expansion interface.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eI\/O Density Scaling\u003c\/strong\u003e: Accommodates 36 individual IEC box-style screw terminals in a single-slot footprint, allowing field wiring termination for high-density discrete or analog VersaMax I\/O modules.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFirmware Flash Compatibility\u003c\/strong\u003e: Provides passive mechanical and electrical backplane connectivity, enabling hot-swap insertion and execution of I\/O modules without disturbing physical field terminal wiring.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: What conductor sizes are supported by the 36 IEC box-style terminals on the IC200CHS022A?\u003c\/p\u003e\n\u003cp\u003eA: The terminals accept a single AWG #14-22 solid or stranded wire, or up to two wires rated up to AWG #18 per terminal point.\u003c\/p\u003e\n\u003cp\u003eQ: How is backplane power and communication passed between adjacent carriers?\u003c\/p\u003e\n\u003cp\u003eA: Integrated carrier-to-carrier side connectors pass backplane data signals and internal logic power automatically when carriers are snapped together on the DIN rail.\u003c\/p\u003e\n\u003cp\u003eQ: Is external grounding mandatory for DIN rail installations?\u003c\/p\u003e\n\u003cp\u003eA: Yes, electrical chassis grounding via the DIN rail or dedicated grounding clip is required to ensure EMC protection and proper noise immunity across field terminals.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eDIN Rail Mounting\u003c\/strong\u003e: Snap the carrier onto a standard 35 mm DIN rail, ensuring the grounding clip firmly contacts the metal rail surface to satisfy EMC bonding requirements.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCarrier Interconnection\u003c\/strong\u003e: Slide adjacent carriers together prior to installing I\/O modules to lock the side carrier-to-carrier connectors and ensure continuous backplane continuity.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eField Terminal Wiring\u003c\/strong\u003e: Strip field conductors to manufacturer specifications and secure within the IEC box terminals, observing maximum wire gauge limits (single #14-22 AWG or dual #18 AWG).\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eModule Insertion\u003c\/strong\u003e: Align the VersaMax I\/O module with the carrier guide keys and press downward until latching mechanisms fully lock the module into the carrier backplane interface.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":45328698900595,"sku":"IC200CHS022A","price":88.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0644\/4348\/2227\/files\/IC200CHS022_1200x1200_54e76747-11a0-44f2-8e9d-b0fb1120730a.jpg?v=1786083207","url":"https:\/\/www.dcssupplier.com\/products\/ge-fanuc-ic200chs022a-versamax-box-style-i-o-carrier","provider":"DcsSupplier Limited","version":"1.0","type":"link"}