{"product_id":"schneider-bmxxbp1002-modicon-x80-backplane-rack","title":"Schneider BMXXBP1002 Modicon X80 Backplane Rack","description":"\u003cp\u003eConfigured for mechanical module hosting and dual-bus signal distribution in Modicon X80 automation network platforms, the \u003cstrong\u003eSchneider Electric BMXXBP1002\u003c\/strong\u003e (\u003cstrong\u003eBMXXBP1002\u003c\/strong\u003e Rack Chassis) provides direct physical\/electrical execution. The hardware functions as a multi-slot structural backplane that routes both asynchronous serial X-bus signals and high-bandwidth deterministic Ethernet packets between plugged processors, power supplies, and high-density I\/O units.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eBMXXBP1002\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eSchneider Electric\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eFrance (FRA)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e1.37 kg (Net backplane mass) \/ 1.384 kg (Packaged unit mass)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e6.600 cm x 15.300 cm x 59.000 cm (Packaged volume envelope)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to +60 deg C (Continuous execution limits)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e251 mW at 3.3 V DC \/ 3.9 W at 24 V DC (Internal rail allocation)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCurrent Consumption\u003c\/td\u003e\n\u003ctd\u003e76 mA at 3.3 V DC \/ 162 mA at 24 V DC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSlot Configuration\u003c\/td\u003e\n\u003ctd\u003e10 slots total (8 slots supporting X-bus + Ethernet \/ 2 slots supporting X-bus only)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProduct Compatibility\u003c\/td\u003e\n\u003ctd\u003eBMX\/BME Processors, BMXCPS4002 Power Supplies, Specific Application Modules, X80 I\/O Modules\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eExpansion Interface\u003c\/td\u003e\n\u003ctd\u003e1 dedicated connector slot for XBE expansion modules\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFixing Methods\u003c\/td\u003e\n\u003ctd\u003e4x M6 screws for plate mounting \/ 4x screws (4.32 to 6.35 mm diameter) for panel mounting\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProtection Rating\u003c\/td\u003e\n\u003ctd\u003eIP20 \/ Relative humidity: 5 to 95% non-condensing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eReliability Profile\u003c\/td\u003e\n\u003ctd\u003eMTBF 1,184,170 hours\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDirectives\u003c\/td\u003e\n\u003ctd\u003e2014\/35\/EU (Low Voltage), 2014\/30\/EU (EMC)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eSchneider Electric Deterministic Network Architecture\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eProfinet \/ EtherNet\/IP Deterministic Networks Integration:\u003c\/strong\u003e The module integrates a parallel dual-bus architecture across its physical copper tracks. It embeds deterministic Ethernet traces directly into 8 of its slot connectors, enabling BME processors to cycle EtherNet\/IP and Profinet frames directly to specialized communication and digital network devices without protocol conversion lag.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eI\/O Density Scaling Matrix Protection:\u003c\/strong\u003e The internal layout sets fixed characteristic impedance across all 10 card channels. This design maintains steady square-wave clock edges across maximum I\/O density configurations, preventing localized noise injection or signal cross-talk from corrupting register transfers during high-speed CPU scan tasks.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: What are the restrictions for hot-swapping or replacing elements inside the BMXXBP1002 frame?\u003c\/p\u003e\n\u003cp\u003eA: Standard Modicon X80 peripheral I\/O modules can be hot-swapped while the backplane rails are energized. However, the BMX\/BME processor module and the primary BMXCPS4002 power supply module must never be unseated or inserted under live conditions; doing so breaks the internal 3.3 V DC and 24 V DC backplane power rails, causing an immediate drop of all active control loops.\u003c\/p\u003e\n\u003cp\u003eQ: How do the two X-bus-only slots function compared to the eight dual-bus slots?\u003c\/p\u003e\n\u003cp\u003eA: The final two slots lack the physical internal traces required to route Ethernet backplane networks. These slots are dedicated exclusively to standard X-bus serial modules, such as discrete input\/output cards and classic counter blocks, freeing up the high-speed Ethernet-enabled slots for intensive network or process automation modules.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eChassis Layout Alignment, Clearance Constraints, and Mechanical Seating:\u003c\/strong\u003e Mount the 1.37 kg backplane horizontally onto a flat plate using four M6 structural screws or onto a structural panel using fasteners between 4.32 mm and 6.35 mm in diameter. To ensure unrestricted passive thermal convection air currents, maintain a strict mechanical boundary clearance of 50 mm above, below, and around the rack perimeter.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eConductor Separation, Wireway Constraints, and Shield Grounding:\u003c\/strong\u003e Route all external field wiring and communication cabling through dedicated plastic trays separated from high-potential AC lines or motor starter wiring. Ensure that the metallic grounding points on the rear of the backplane establish tight metal-on-metal contact with the enclosure backplate, which must link directly to the master copper earth ground bar to discharge ambient electrostatic spikes.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Schneider","offers":[{"title":"Default Title","offer_id":45141486436467,"sku":"BMXXBP1002","price":88.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0644\/4348\/2227\/files\/screenshot_2026-06-30_15-57-35.png?v=1782806454","url":"https:\/\/www.dcssupplier.com\/products\/schneider-bmxxbp1002-modicon-x80-backplane-rack","provider":"DcsSupplier Limited","version":"1.0","type":"link"}