ABB DSBB175 Backplane Board

Configured for central communication and power distribution in ABB distributed control systems, the ABB DSBB175 (DSBB175 Backplane Board) provides direct physical/electrical execution.

Hardware Specifications

Backplane Bus Communication Velocity and Firmware Flash Compatibility

• Backplane Bus Velocity: Operates as the central high-speed communication backbone, routing data signals and power distribution lines across interconnected CPU, I/O, and interface modules.
• I/O Density Scaling: Supports modular rack expansion, allowing scaling of I/O channel density and controller modules within industrial panel enclosures.
• Firmware Flash Compatibility: Provides bus electrical stability during live module firmware flash operations and system reboot cycles without disturbing adjacent rack slots.

Frequently Asked Questions

Q: Does the DSBB175 backplane board contain active processing onboard?

A: The DSBB175 functions as a passive backplane structure designed for communication signal routing and power distribution between inserted modules.

Q: What environmental temperature range is supported by the DSBB175 backplane board?

A: The board is rated for operation within ambient temperatures ranging from -10 to +60 deg C.

Q: How does the DSBB175 backplane handle module power distribution?

A: Power supply modules plugged into the backplane deliver system DC voltages across internal traces to power adjacent control and I/O hardware.

Field Installation Guidelines

• Mount the DSBB175 backplane board securely inside the enclosure panel using all designated mounting points to handle physical vibration.
• Bond the backplane chassis ground connection directly to the protective earth (PE) bus using a heavy copper braid or grounding conductor.
• Align edge connectors carefully prior to seating controller, I/O, and power modules into backplane slots to avoid pin deformation.
• Verify that ambient panel temperature remains within the -10 to +60 deg C range by maintaining proper ventilation pathways around the card rack assembly.