Allen-Bradley 1745-E107 SLC 100/150 Analog Expansion Unit

The Allen-Bradley 1745-E107, also cataloged as the 1745-E107 PLC Expansion Unit, operates as a dedicated hardware component for localized analog input signal processing within Allen-Bradley SLC 100/150 platforms.

Hardware Specifications

Allen-Bradley Technical Characteristics

• Backplane Bus Communication Velocity: Transfers digitized analog input channel values across the local expansion bus interface to guarantee deterministic register updates without increasing PLC processor scan-time latency.
• I/O Density Scaling: Integrates additional analog input channels directly into the base controller memory map, providing modular expansion without requiring external remote communication protocols.

Frequently Asked Questions

Q: Can the 1745-E107 expansion unit be hot-swapped while the system is under power?

A: No. Connecting or removing the interconnect cable while power is active can corrupt backplane bus communication and trip primary CPU hardware fault routines.

Q: How is logic and bus communication power delivered to the 1745-E107 unit?

A: Power is supplied through the dedicated bus interconnect cable connected to the primary SLC 100/150 processor base unit or preceding expansion chassis.

Q: Is a dedicated communication interface card required to interface the 1745-E107 with an SLC 150 CPU?

A: No. The unit connects directly to the local backplane expansion socket of the SLC 100 or SLC 150 controller via a standard interconnect cable.

Field Installation Guidelines

1. Isolate all primary AC/DC power sources from the main processor unit and attached expansion chassis prior to mounting or connecting the 1745-E107 module.
2. Secure the expansion unit frame tightly to the metal enclosure mounting panel to maintain proper frame earth grounding and mechanical stability.
3. Utilize shielded twisted-pair cabling for all analog input signal lines, ensuring shield termination occurs at a single grounded point to prevent ground loop interference.
4. Maintain a 2.0 in (50.8 mm) minimum operational clearance above and below the chassis assembly to allow proper thermal convective airflow inside the cabinet.