GE Fanuc IC200CHS022A VersaMax Box-Style I/O Carrier

The GE Fanuc IC200CHS022A, also cataloged as the IC200CHS022 Box-Style I/O Carrier, operates as a dedicated hardware component for field terminal breakdown and module mounting within VersaMax platforms.

Hardware Specifications

Backplane Bus and I/O Density Scaling

• Backplane Bus Communication Velocity: Interfaces directly with adjacent carrier base units via integrated carrier-to-carrier connectors, maintaining continuous backplane bus signal pass-through across the local rack expansion interface.
• I/O Density Scaling: Accommodates 36 individual IEC box-style screw terminals in a single-slot footprint, allowing field wiring termination for high-density discrete or analog VersaMax I/O modules.
• Firmware Flash Compatibility: Provides passive mechanical and electrical backplane connectivity, enabling hot-swap insertion and execution of I/O modules without disturbing physical field terminal wiring.

Frequently Asked Questions

Q: What conductor sizes are supported by the 36 IEC box-style terminals on the IC200CHS022A?

A: The terminals accept a single AWG #14-22 solid or stranded wire, or up to two wires rated up to AWG #18 per terminal point.

Q: How is backplane power and communication passed between adjacent carriers?

A: Integrated carrier-to-carrier side connectors pass backplane data signals and internal logic power automatically when carriers are snapped together on the DIN rail.

Q: Is external grounding mandatory for DIN rail installations?

A: Yes, electrical chassis grounding via the DIN rail or dedicated grounding clip is required to ensure EMC protection and proper noise immunity across field terminals.

Field Installation Guidelines

• DIN Rail Mounting: Snap the carrier onto a standard 35 mm DIN rail, ensuring the grounding clip firmly contacts the metal rail surface to satisfy EMC bonding requirements.
• Carrier Interconnection: Slide adjacent carriers together prior to installing I/O modules to lock the side carrier-to-carrier connectors and ensure continuous backplane continuity.
• Field Terminal Wiring: Strip field conductors to manufacturer specifications and secure within the IEC box terminals, observing maximum wire gauge limits (single #14-22 AWG or dual #18 AWG).
• Module Insertion: Align the VersaMax I/O module with the carrier guide keys and press downward until latching mechanisms fully lock the module into the carrier backplane interface.