GE Fanuc IC697PWR711K Series 90-70 Power Supply Module

The GE Fanuc IC697PWR711K, also cataloged as the IC697PWR711 Power Supply Module, operates as a dedicated hardware component for multi-output backplane power distribution within GE Fanuc Series 90-70 PLC platforms.

Hardware Specifications

GE Fanuc Technical Characteristics

• Backplane Bus Communication Velocity: Delivers regulated +5 VDC logic rails and auxiliary +12 VDC / -12 VDC supply paths directly across the Series 90-70 rack backplane, maintaining bus stability during high-density processor and I/O execution cycles.
• I/O Density Scaling: Supports high-density rack configurations by supplying up to 100 W total power across multiple voltage rails to power CPUs, communication coprocessors, discrete modules, and analog interfaces from a single rack position.

Frequently Asked Questions

Q: Does the IC697PWR711K power module support hot-swappable installation within a Series 90-70 rack? A: Yes. The IC697PWR711K features hot-swappable hardware capability, permitting insertion or removal without requiring full platform shutdown.

Q: What protection mechanisms are integrated into the internal circuitry of the IC697PWR711K? A: The module is equipped with built-in electronic short-circuit protection, overload protection, overvoltage protection, and over-temperature protection routines.

Q: What are the primary DC output voltage rails generated by the IC697PWR711K? A: The module provides three regulated output supply rails: +5 VDC (up to 10 A), +12 VDC (up to 12 A), and -12 VDC (up to 18 A).

Field Installation Guidelines

1. Verify that the incoming line supply voltage matches the wide input threshold rating of 85-264 VAC (47-63 Hz) prior to connecting field supply wiring.
2. Slide the modular assembly along the rack guide rails until the backplane connectors line up and seat fully into the chassis frame.
3. Ensure the module frame earth ground connection is firmly bonded to the main enclosure backplate to mitigate electromagnetic interference and maintain low ripple characteristics.
4. Maintain unrestricted convective airflow around the module frame to prevent internal over-temperature protection tripping during high continuous power dissipation.