GE IC670MDL640B Field Control Analog Input Module

The GE IC670MDL640B, also cataloged as the IC670MDL640 Analog Input Module, operates as a dedicated hardware component for multi-channel analog voltage and current signal digitization within Field Control distributed I/O networks. This module converts raw sensor inputs into digitized logic values for transmission to the central field bus terminal block.

Hardware Specifications

Backplane Bus Communication & IO Density Scaling

The module communicates with the Field Control bus header using the backplane bus communication velocity architecture, transferring digitized 12-bit input registers directly across the internal bus interface. Designed with optimized I/O density scaling, the high-density layout integrates analog signal conditioning, A/D conversion, and optical isolation into a compact terminal block mount. Internal trace shielding and firmware flash compatibility preserve deterministic data updates and prevent signal crosstalk during high-speed field scan cycles.

Frequently Asked Questions

Q: Does the IC670MDL640B require external loop power for 4-20 mA current transmitters?

A: Yes, current loops must be powered by an external 24 VDC auxiliary loop supply or loop power terminals on the mounting base, as the module inputs are passive receiver circuits.

Q: How is electrical isolation maintained between field wiring and internal bus logic?

A: The module incorporates optocouplers to provide 1500 VAC isolation between the field input terminals and the internal logic communication backplane.

Q: Can the input channel signal ranges be configured individually?

A: Input signal ranges are software-configurable per channel via the central controller configuration software or network master interface.

Field Installation Guidelines

• De-energize all field power and backplane power sources prior to inserting or removing the module from its terminal base.
• Route all 4-20 mA and voltage input signals using twisted, shielded pair cabling to minimize external electromagnetic interference.
• Land cable shield drain wires at the enclosure earth grounding bar; do not ground shields at both ends to prevent ground loop currents.
• Maintain adequate separation between low-level analog input signal conduits and high-voltage AC power wiring inside wire ducts.
• Ensure the terminal base mounting screws are tightened securely to guarantee low-impedance ground bonding to the panel surface.