GE IC693CHS398B 10-Slot Baseplate Chassis

Configured for module rack mounting and passive backplane interconnectivity in Series 90-30 PLC systems, the GE IC693CHS398B (IC693CHS398 10-Slot Chassis) provides direct physical/electrical execution.

Suffix Breakdown & Model Matrix

Hardware Specifications

Backplane Bus Communication Velocity & I/O Scaling

The chassis utilizes a passive backplane constructed with heavy-duty printed circuit board traces and surface-mount technology to maintain backplane bus communication velocity up to 1 Mbps. Designed without active electronic components on the bus, the unit reduces component failure rates and preserves signal integrity during rapid logic scans. High-density I/O density scaling allows the chassis to accommodate up to 10 I/O or option modules alongside a dedicated power supply module, supporting total system expansion up to 2,048 discrete and analog points via expansion ribbon cable interconnects.

Frequently Asked Questions

Q: Does the IC693CHS398B passive chassis consume internal backplane power?

A: No. The chassis contains no active semiconductor components and consumes 0 W of electrical power. All operating power for inserted I/O cards is drawn directly from the power supply module mounted in the dedicated bay.

Q: How is system earthing and noise suppression managed across the chassis hardware?

A: The chassis is constructed with a heavy-duty metal frame and includes an integrated ground bar to establish low-impedance earthing across all inserted module shields and backplane tracks.

Field Installation Guidelines

1. Mount the chassis securely to a flat panel or standard 19-inch rack frame using the designated mounting holes, ensuring adequate clearance above and below for natural convection cooling.
2. Ensure the chassis ground bar is bonded directly to the main cabinet protective earth (PE) ground using a heavy-gauge copper conductor.
3. Install the system power supply module exclusively in the leftmost dedicated power supply slot prior to inserting I/O or communication modules into slots 1 through 10.
4. When interconnecting expansion chassis, ensure expansion ribbon cables are fully seated and secured before applying power to the rack.