GE IC697CH5750C Series 90-70 Chassis Rack

Configured for structural module housing and backplane signal routing in Series 90-70 platforms, the GE IC697CH5750C (IC697CH5750 Chassis Rack) provides direct physical/electrical execution. This 10-slot 19-inch rack accepts single-row CPU, power supply, and option cards, interconnecting them via an active backplane with integrated bus termination. It manages high-speed internal bus transfers across single or dual redundant backplane configurations without external jumpers.

Suffix Breakdown & Model Matrix

The catalog identifier for the GE IC697CH5750C breaks down into platform, structural, and revision designations across the Series 90-70 family:

• IC697: Designates the GE Fanuc Series 90-70 modular industrial controller product platform.
• CHS: Identifies the chassis and backplane rack assembly structural group.
• 750: Specifies the 10-slot 19-inch rack form factor with single horizontal row card layout.
• C: Indicates hardware revision C, incorporating active bus termination circuits, dual PC boards, and updated backplane trace routing.

Hardware Specifications

Backplane Bus Communication Velocity & Firmware Flash Compatibility

The GE IC697CH5750C active backplane supports a 2.5 Mbit/s bus transfer rate using automatic bus arbitration across its 10 module slots. Integrated bus termination circuits across the 2 internal PC boards stabilize high-frequency signal edges, maintaining deterministic timing during high-density I/O sweeps. The passive backplane hardware trace layout maintains continuous backplane bus communication velocity and firmware flash compatibility across all Series 90-70 CPU models, ensuring error-free instruction synchronization and bus communication regardless of host controller revision.

Frequently Asked Questions

Q: Does the IC697CH5750C rack support hot-swapping of installed modules while powered?

A: The IC697CH5750C rack backplane hardware supports hot-swapping for most standard I/O modules during operation. However, power supply and CPU modules must not be removed while the rack is energized to prevent backplane bus faults or memory corruption.

Q: What is the purpose of the internal 330 uF capacitance on the backplane assembly?

A: The 330 uF internal capacitance decouples operational power rails (+5V and +24V) across the backplane bus, filtering voltage transients caused by module insertion, output switching, or external supply fluctuations.

Q: Can the IC697CH5750C be mounted vertically inside an enclosure?

A: No. The rack is designed exclusively for horizontal mounting in standard 19-inch cabinets. Horizontal placement is mandatory to align ventilation slots correctly for passive convection cooling of installed modules.

Field Installation Guidelines

1. Cabinet Mounting: Align the rack mounting ears horizontally with standard 19-inch cabinet rails. Secure using four M6 panel mounting screws, ensuring unobstructed airflow around top and bottom ventilation slots.
2. Earth Grounding: Bolt a green/yellow earth ground conductor (minimum 14 AWG / 2.5 mm sq) directly to the frame grounding studs. Ensure low-impedance connection to cabinet star ground for ESD protection.
3. Power Supply Placement: Install the primary Series 90-70 power supply module into the dedicated power supply slot before seating control or I/O modules. Verify front-panel +5V and +24V status LEDs illuminate upon powering.
4. Module Engagement: Insert 48-pin module edge connectors straight into card slot guides. Push firmly until the module seats into the backplane connector and engage upper/lower retaining latches.
5. Environmental Control: Maintain cabinet ambient operating temperatures between 0 deg C and 55 deg C and relative humidity below 95% non-condensing.