GE Fanuc IC693ACC310A Series 90-30 Filler Module

Configured for physical slot protection and backplane bus shielding in Series 90-30 platforms, the GE Fanuc IC693ACC310A (IC693ACC310 Filler Module) provides direct physical/electrical execution. This single-slot module fills unassigned I/O and coprocessor slots across local, expansion, remote, and distributed racks to maintain proper air circulation and shield internal backplane connectors from environmental debris.

Hardware Specifications

Dedicated Hardware Features

The IC693ACC310A module maintains backplane structural integrity and thermal management within Series 90-30 baseplates. By occupying unassigned slots, the passive plastic housing enforces predictable forced-air routing across adjacent active cards while preventing electrical shorting from conductive dust or dropped hardware. The module seamlessly accommodates I/O density scaling and rack expansion configurations without drawing power or consuming backplane communication bandwidth.

Frequently Asked Questions

Q: Does the IC693ACC310A filler module require power or draw current from the 5 VDC backplane?

A: No, the unit is a completely passive non-electrical component. It contains no internal circuitry, active bus contacts, or firmware, and draws zero current from the backplane power supply.

Q: Can the IC693ACC310A module be installed or removed while the rack is powered?

A: Yes, because the filler module contains no electrical connections or active backplane signal pins, it can be safely inserted or removed from an empty rack slot during live system operation without interrupting backplane communications.

Field Installation Guidelines

1. Slot Inspection: Inspect the vacant rack position on the Series 90-30 baseplate for any physical debris, dust, or damage to the backplane connector before insertion.
2. Mechanical Alignment: Align the top and bottom guide rails of the IC693ACC310A module with the card guides of the empty rack slot.
3. Module Seating: Push the filler module firmly into the rack until the upper and lower plastic retention clips snap securely onto the baseplate frame.
4. Airflow Verification: Ensure all unused rack slots in high-temperature or dirty industrial environments are populated with filler covers to preserve thermal cooling vectors and internal backplane isolation.