GE IC660TSS100 I/O mountable terminal assembly

Configured for physical wire termination and I/O block integration in GE Fanuc Genius I/O networks, the GE Fanuc IC660TSS100 (IC660TSS Terminal Assembly) provides direct physical/electrical execution. This mountable base unit establishes the electrical interface between field wiring and active logic blocks, maintaining circuit continuity under continuous industrial vibration up to 10 Hz.

Hardware Specifications

I/O Density Scaling and Backplane Bus Integration

The IC660TSS100 enables hardware I/O density scaling within GE Fanuc distributed control architectures. By separating the physical field wiring base from the active microprocessor electronics, the terminal assembly supports immediate node expansion without requiring backplane bus communication velocity licenses. This modular two-piece footprint optimizes cabinet density while ensuring the deterministic network transmission rates of the Genius bus remain unaffected during block replacement or wire maintenance procedures.

Frequently Asked Questions

Q: Can field wiring remain connected to the terminal assembly while replacing the active I/O logic block?

A: Yes, the split-block design allows the active electronic module to be extracted from the base while all field wiring remains securely terminated on the IC660TSS100.

Q: What are the primary environmental constraints for mounting this terminal assembly?

A: The unit must operate strictly within ambient temperatures of 0 to 40 deg C, maintain environments below 80% non-condensing relative humidity, and be installed at altitudes not exceeding 1000 m above sea level.

Field Installation Guidelines

1. Vibration Isolation Mounting: Secure the terminal assembly base to panel surfaces ensuring the installation environment does not exceed the mechanical tolerance limit of 5-10 Hz with 0.2 inches of displacement.
2. Wire Termination and Strain Relief: Route all incoming field conductors through appropriate strain relief channels before landing on the terminal block to prevent mechanical tension on internal bus contacts.
3. Thermal Management Limits: Provide adequate cabinet ventilation or forced air cooling. The operational thermal limit is strictly capped at 40 deg C ambient; localized heat buildup from adjacent high-power relays must be monitored.